I am having a hard time with oven soldering the E Series Board. We have a PCB with pads for the castellated pins on the E Series module, and we apply an even layer of solder with a stencil. However, after putting the board through the IR oven, the solder on the pads will melt, but often many pins would not bind well to E Series module. Adding additional solder to each pin helps, but even then sometimes the solder doesnt fully bind, and this is fairly time consuming.
Has anybody else encountered this issue? Aside from soldering it by hand, are there any tips or tricks I could employ so that the solder better binds?