We are moving towards manufacturing our units at a larger scale, therefore we are trying to switch from Electron to the E-Series to make this process more streamline. We are using both the E-Series development kit and our own PCB for the E-Series chip itself and getting the same results from both.
The problem we are facing is that when using the Electron, we were having above 99% up time on our units. After switching to the E-Series, the up time decreased almost 10% when using the same code besides switching the pins. We are aware of the different U-Blox modules (3G vs LTE) and taken action to account for those modules as far as ensuring that appropriate signals are available for the units in the area that they are being tested and that they are not congested.
According to the datasheets, both units have the same power demands so I believe the power management shouldn’t be the issue if they are both connected the same way. Let me know if this is not the case!
Is there a different process when connecting, reconnecting, publishing, etc. that should be done differently on the E-Series rather than the Electron?
Any other suggestions (code/hardware) that we should look out for when switching from Electron to the E-Series?